To expose each component’s die for inspection, Electronica Test Labs uses a combination of mechanical package removal along with environmentally-safe, heated acid etching methods on the area of the package to be removed. Die markings, size and layout are examined and photographed for review. We compare each component die against our comprehensive database of golden component samples, original manufacturer’s datasheets, and other commercially available guidelines to arrive at an unbiased conclusion.

Please reach out to us at info@electronicalabs.com to learn more about our decapsulation testing.